| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder paste from being defamed by making a separation speed immediately after the start of separation higher than a separation speed that follows when an action to separate a print substrate from a mask plate is performed intermittently. SOLUTION: When each of pattern holes 2a of a mask plate 2 is fully filled with a solder paste 13, a control part reads a speed pattern stored in a speed pattern storage part and actuates a first Z motor through a drive part to separate a print substrate 4 from the underside of the mask plate 2. The solder paste 13 is prepared by mixing solder particles each having a diameter of about tens ofμm into flux. Thus, if the substrate 4 is lowered in a predetermined speed pattern, a relative slippage (shear), that is, a slip rate (v) (or shear rate v) is generated among solder particles near the inner wall surface of the hole 2a.
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