发明名称 OVERCURRENT CUTOFF DEVICE
摘要 PROBLEM TO BE SOLVED: To break securely a current-conducting path through which an overcurrent is made to flow with high responsiveness by connecting a conductive wire to generate heat by means of overcurrent between a pair of conductors, covering the periphery of the conductive wire with a resin and forming a thin covering layer in the vicinity of the route of the conductive wire. SOLUTION: A conductive wire 3 to generate heat by overcurrent is connected between a pair of electrode pieces 1, 2 by means of wire bonding, and then, a resin layer 4 is formed by covering the periphery of the conductive wire 3, for instance, in a condition that seals it with a molded resin such an epoxy resin by means of transfer mold using a molding die. When the resin layer 4 is formed, a thin covering layer 5 is formed at the same time by recessing the vicinity of the route of the conductive wire 3 into a circular form. Thereby, when the conductive wire 3 connected between the pair of electrode terminal pieces 1, 2 generates heat and raise temperature, the heat of the resin layer 4 is concentrated on the thin covering layer 5 and a large quantity of gas is produced during the carbonization process of the resin. Then, a small- scale gas explosion occurs and a current-carrying path of a part forming the thin covering layer 5 is securely broken.
申请公布号 JPH11345553(A) 申请公布日期 1999.12.14
申请号 JP19980169225 申请日期 1998.06.02
申请人 OMRON CORP 发明人 KANAMARU NAOYUKI;MOTOYAMA NAOKI;WATAJIMA YOSHINORI;FUJIMOTO TAKU;SAWAMURA TETSUYA;MATSUNAGA NOBUTOMO;YOSHIDA KAZUTAKA;SUGIMOTO SHUICHI;TOKI YOSHIHISA
分类号 H01H37/76;H01H69/02;H01H85/00;H01H85/02;H01H85/041;H01H85/06;H01H85/08;H01H85/12;H01H85/153;H01H85/165;H01H85/20;H01H85/30;H01H85/36 主分类号 H01H37/76
代理机构 代理人
主权项
地址