| 摘要 |
PROBLEM TO BE SOLVED: To easily produce a semiconductor acceleration sensor having a high impact resistance. SOLUTION: A distance between a weight 5 and a package is fixed with accuracy, by providing a stopper 13 on a top face of a lower package 10, providing a weight positioning jig contacting with a top face of the stopper 13 and an end face of the lower package 10, and positioning the weight 5 while determining a three-dimensional position of the weight 5 with an upper portion of the inside and an end face of the side of the weight positioning jig by evacuation, resulting that it is possible to measure the acceleration at the maximum insofar as a sensor element 1 will not break. |
