发明名称 FORMING OF COPPER HOLLOW STRUCTURAL BODY
摘要 PROBLEM TO BE SOLVED: To obtain a structural body which is easily applied to a copper hollow structural body of a complicated shape and enables mass production and cost reduction by applying Au plating to a joint part of a groove and a cover formed with copper, and heating/joining them in a furnace. SOLUTION: A gold plated layer 6 of 20-40μthick is formed on the side of a pure copper cover 2 joined with a pure copper groove structural body 1, and is put on the body 1 and held in a vacuum furnace at 1,010 deg.C for 30 minutes. Thus, the gold (melting point is 1,063 deg.C) of the gold plated layer 6 and the copper (melting point is 1,083 deg.C) are alloyed by diffusion, resulting in the reduction of the melting point. They function as a Au-Cu brazing material, so that the body 1 and the cover 2 are thermal-joined by brazing in the furnace to form the copper hollow structural body. Therefore, since gold plating can be easily carried out even in the case of a difficult-to-apply complicated shape, the copper hollow structural body can be easily formed according to this method. Furthermore, mass production is possible, resulting in reduction of cost for manufacturing the copper hollow structural body.
申请公布号 JPH11342465(A) 申请公布日期 1999.12.14
申请号 JP19980149142 申请日期 1998.05.29
申请人 MITSUBISHI HEAVY IND LTD 发明人 FUKUSHIMA AKIRA;ONDA TAKASHI;FUJIWARA TSUTOMU
分类号 B23K1/00;B23K1/19;(IPC1-7):B23K1/00 主分类号 B23K1/00
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