| 摘要 |
Apparatus for applying uniform layers of adhesive to contoured surfaces of a substrate comprises, in one embodiment, a die head mounted to an adhesive dispenser and having contoured first and second die faces offset relative to each other. One of the die faces is operable to contact the contoured surface of the substrate, and a contoured slot outlet in fluid communication with the adhesive dispenser is disposed between the die faces for applying adhesive material to the contoured surface of the substrate. In another embodiment of the invention for simultaneously applying adhesive to multiple non-coplanar surfaces of a substrate, the die head comprises multiple non-coplanar die faces, each having first and second die face portions offset relative to each other. One of the die face portions of each multiple die face is operable to contact a respective non-coplanar surface of the substrate. A slot outlet communicates with each of the multiple die faces for applying adhesive material to each of the multiple surfaces of the substrate. In yet another embodiment of the invention for applying adhesive material to flexible members of a substrate, a die head comprises first and second die face portions offset relative to each other and contoured to provide a uniform layer of adhesive to the flexible member of the substrate. Methods of applying uniform layers of adhesive to contoured surfaces of a substrate are also disclosed.
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