发明名称 METHOD FOR IMAGE-PICKING UP MACHINED MATERIAL BY THREE-DIMENSIONAL LASER BEAM MACHINING DEVICE AND THREE-DIMENSIONAL LASER BEAM MACHINING DEVICE USING THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide a machined material image pickup method by three-dimensional laser beam machining device, which can stably detect a picture even if the direction of illumination changes or material quality of a high reflectance is used, and to provide a three-dimensional laser beam machining device using the method. SOLUTION: In the three-dimensional laser beam machining device provided with a three-dimensional laser beam machining head 1 having a CCD camera 5, an illumination means 15 illuminating an image-picked up part 7 and with a picture processor, a light source 19 which can freely move on a circular orbit is installed in the illumination means 15. The light source 19 is moved to a plurality of positions on a circular orbit, the image-picked up part 7 is image-picked up by the CCD camera 5 in a plurality of light source positions, a plurality of pictures obtained by eliminating a picture area of more than a prescribed lightness are generated from a plurality of image pickup pictures, a plurality of generated pictures are overlapped and the whole pictures are composited.
申请公布号 JPH11345335(A) 申请公布日期 1999.12.14
申请号 JP19980153286 申请日期 1998.06.02
申请人 AMADA CO LTD;AMADA ENG CENTER CO LTD 发明人 ONODERA HIROSHI;ANZAI TETSUYA
分类号 B23K26/02;B23K26/03;G06T1/00;G06T7/00 主分类号 B23K26/02
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