| 摘要 |
PROBLEM TO BE SOLVED: To materialize the cost reduction of a product and the shortening of the period for development by halving the manufacture cost of a chip supporting board for supporting a semiconductor chip. SOLUTION: The pad for power, the pad for ground, and the pad for signals of a semiconductor chip 1 are made, each based on fixed arrangement rules, and moreover a common board electrode 2a for power where the pad for power is to be connected, a common board electrode 2b for ground where the pad for ground is to be connected, and a common board electrode 2c for signals are made, corresponding to fixed arrangement rules, on the chip supporting board 2, and any kind of semiconductor chip 1 can be connected to the same kind of chip supporting board 2, from among plural kinds of semiconductor chips 1 being made, based on the fixed arrangement rule. |
