| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size and weight of an image pickup device so that the device may be handled easily by holding a glass substrate carrying a photoelectric conversion element on a metallic pedestal, and providing a heat pipe which is a thermal conduction element in the pedestal as a thermal element. SOLUTION: The base material of a pedestal 8 which also works as a driving circuit board is composed of a metal and the heat generated from a reading-out IC, driver IC, etc., can be discharged to the outside from the enclosure 9 of an image pickup device by laying part of a heat pipe 26 which is a thermal converting element in the pedestal 8. When the image pickup device is constituted in such a way, the heat can be dissipated effectively and the temperature difference between the ICs can be reduced without increasing the heat capacity of the base material of the pedestal 8. Therefore, the weight and size of the image pickup device can be reduced without sacrificing the performance of the device. Since the pedestal 8 is efficiently cooled, moreover, the temperature of a photoelectric conversion element itself is stabilized and, as a result, stable picture information reading is realized. |
