| 摘要 |
PROBLEM TO BE SOLVED: To prevent the disconnection, short-circuiting, etc., of solder balls when a semiconductor device is mounted on a wiring board by sealing the surface of a semiconductor element and the junction between the element and the board with a resin, and providing recessing and projecting sections in the sticking portion of a frame-like rigid body to a flexible substrate. SOLUTION: Solder balls 4 for mounting wiring board are connected to wires provided on a flexible substrate at appropriate intervals. The junctions between the circuit forming surface of a semiconductor element and wiring leads are sealed with a sealing resin 5 and a reinforcing frame 6 is stuck to the rear surface of the flexible substrate with an adhesive 7. Then recessing and projecting sections are provided on the frame 6 and the frame 6 is stuck to the flexible substrate with the adhesive 7 provided on the projecting sections 8. Since the sticking area of the frame 6 to the flexible substrate becomes smaller, the entrainment of air at the sticking time is reduced and, at the same time, entrained air can be discharged easily by pressurization. Moreover, even when the sticking section of the frame 6 to the flexible substrate partially comes off in a heating process which is performed for mounting a semiconductor substrate on a wiring board, no breaking, disconnection, etc., of wires occurs in the junction between the flexible substrate and wiring board, because the sticking area is small. |
