| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-contact IC card which corresponds to various IC modules that have different sizes of IC chips and various card demands, satisfies a requested card characteristic, such as durability and mechanical characteristic and also is inexpensive and to provide its manufacturing method. SOLUTION: This non-contact IC card 1 is produced by such a manner that a 1st adhesion layer 12 is laminated on the front side of a base 11 and a 2nd adhesion layer 14 is laminated on the rear side respectively, an IC module inlet 13 is put on the sides of the layers 12 and 14 and they are press-stuck to each other by heating and pressing. And, there are such effects as the reduction of the number of operation processes, the reduction of manufacturing time, low cost and the facilitation of integration of manufacturing devices when non-contact IC cards are manufactured in a coherent manufacturing process of the card 1 by constructing a card base that fixes the inlet 13 with a hot-melt resin and also, it is excellent in thermal resistance by using the reactive hot-melt resin. |
