| 摘要 |
<p>PROBLEM TO BE SOLVED: To more reduce the thickness of mounting structure of a resin sealed semiconductor device. SOLUTION: In the resin sealed semiconductor device, a lead frame 1 provided with a land part 10, an inner lead part 11 and an outer lead part 12 is formed, an IC chip 2 is mounted on the land part 10, the IC chip 2 is connected to the inner lead part 11, and a section from the chip 2 to the lead part 11 is molded with resin. In a resin molded part 4, only the thickness of an IC chip loading part and a connection part between the IC chip 2 and the inner lead part 11 is thickened and other parts are thinnly formed. A recessed packaging part 50 consisting of a recessed part or a hole part is formed on a mounting board 5 and the thick part 40 of the resin molded part 4 is fitted into the mounting part 50.</p> |
