| 摘要 |
PROBLEM TO BE SOLVED: To improve workability by mounting a semiconductor device to a circuit board having a fine uneven surface in a manner to make it face down, filling a clearance between the semiconductor device and circuit board with a liquid resin composition containing at least a resin and an inorganic filler whose shape is smaller than the irregularities of the circuit board, and curing them. SOLUTION: Irregulaties 6 are provided finely in advance on the surface of a circuit board 4 with a drill, laser or chemical treatment, etc., and while a semiconductor device 1 is made to face down, it is placed on the specified position of a connection electrode 5. Next, a clearance between the semiconductor device 1 and circuit board 4 is filled with a liquid resin composition 7, and it is heated at about 150 deg.C and cured thereafter. The liquid resin composition 7 contains at least a resin 8 and an inorganic filler 9 whose shape is smaller than the irregularities 6 formed on the circuit board 4. Therefore, the inorganic filler 9 is prevented from entering the irregularities 6, suppressing the clogging of the liquid resin composition 7 due to high concentration. |
