| 摘要 |
A photosensitive resin composition is comprised of (A) a polyimide resin having a weight-average molecular weight of from 5,000 to 150,000, represented by the general formula (I): wherein X is a specified tetravalent organic group having two benzene rings, Y is a member comprised of 30-100 mol % of a specific organic group having two benzene rings and 70-0 mol % of another specific divalent aromatic organic group, Z is a divalent organic group represented by the general formula (VI): wherein b is an integer of 5 to 80; and m and n each represent a number satisfying that m/(m+n) is 0.98 to 0.70 and n/(m+n) is 0.02 to 0.30; (B) an agent selected from a sensitizer and a photopolymerization initiator; and (C) an organic solvent. From this composition, polyimide films having a superior adhesion to substrates and also having no corrosive properties can be formed by low-temperature heat treatment.
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