| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of voids at the time of mounting a semiconductor device on an external circuit board, by forming grooves in bump electrodes for outside connection. SOLUTION: A semiconductor element 10 is mounted on a wiring board 12 and connected to each wire. Then bump electrodes 16 are respectively provided on and connected to electrodes 14 arranged on the wiring board 12, and groove sections 20 are respectively formed into the bump electrodes 16. An external circuit board mounted with a semiconductor device 8 is passed through a reflow process. In the reflow process, the occurrence of voids can be suppressed effectively without taking the volatile gas which is generated when paste-like solder melts in the bump electrodes 16 as bubbles, because the volatile gas is discharged along the groove sections 20 and projecting sections 22 of the bump electrodes 16. Therefore, the reliability of the semiconductor device 8 can be improved. Thereafter, the bump electrodes 16 having a melting point higher than that of the paste-like solder melt and, finally, the semiconductor device 8 is fixed to the external circuit board through a cooling process. |
