| 摘要 |
<p>PURPOSE:To ensure easy resistance trimming adjustment, and stably detect current for a temperature change by packaging a resistor part having a small resistance temperature coefficient on the surface of a board, and covering the packaged part with insulation resin having high heat conduction. CONSTITUTION:This hybrid integrated circuit device is constituted of a metal board 1, an insulation resin layer 2 pasted thereon, a conductive circuit 3, a power semiconductor element 4, and a current detecting resistance element 5. The element 5 is formed on one surface of a metal piece 5B via an insulation resin film 5C, in such a way as providing a desired form of pattern 5A made of an alloy material having a resistance temperature coefficient approximately between 1 and 500ppm. The element 5 is packaged to the surface of the board 1. According to this construction, the element 5 is used as a part, and resistor trimming adjustment can be accurately undertaken. Also, the temperature coefficient of the pattern 5A is extremely small and, therefore, current can be stably detected for a temperature change. Furthermore, a resistor part is covered and protected with insulation resin 8 having high heat conduction for releasing generated heat therefrom.</p> |
