| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable eliminating solder plating chips by providing air blow holes on a side of a molding punch of a lead forming device provided with a shedder which is movable at least up and down and the forming punch on a die set of a lower die. SOLUTION: A package 10 is formed by mounting a semiconductor chip on an island of a lead frame and sealing it with resin. The package 10 is set on a die 4. An upper die set and a shedder 5 are lowered to cramp the root of leads 11. A molding punch 6 is lowered to the bottom dead center to form the leads 11. During these operations, solder plating chips 9 from the surface of the leads are adhered to the lower side of the molding punch 6. The upper die set is moved upward to eject the semiconductor device whose leads have been formed. Air is jetted with a pressure about 5 kg/cm<2> through air blow holes 8 formed on the side of the molding punch 6. The solder plating chips 9 adhered to the side of the molding punch 6 can be eliminated in this way.</p> |
