发明名称
摘要 PURPOSE:To provide a strip electrolytic polishing device capable of rapidly and effectively polishing the surfaces of the strip used for lead frames without generating deformation in the strip. CONSTITUTION:A first cathode arranging vessel 13, a first treating liquid discharging vessel 14, a first anode arranging vessel 15, a second treating liquid discharging vessel 16, a second anode arranging vessel 17, a third treating liquid discharging vessel 18 and a second cathode arranging vessel 19 are arranged in this order, successively from the introducing direction of the strip 7. The respective vessels are partitioned by partition walls 21 having apertures 20 for passing the strip 7 subjected to the electrolytic polishing treatment. Cathode plates 5 communicating to the cathode 41 of a power source are arranged in the first and second cathode arranging vessels 13, 19 and anode plates communicating to the anode 42 of the power source are arranged in the first and second anode arranging vessels 15, 17. The bottoms of the first and second cathode arranging vessels 13, 19 and the first and second anode arranging vessels 15, 17 are respectively provided with injection ports 25 for electrolytic polishing liquids. The bottoms of the second and third treating liquid discharging vessels 16, 18 are provided with discharge ports 26 for the electrolytic polishing liquids.
申请公布号 JP2988567(B2) 申请公布日期 1999.12.13
申请号 JP19940192750 申请日期 1994.07.26
申请人 SUMITOMO KINZOKU KOZAN KK 发明人 TEZUKA YOSHIMARO;KOZUKI YASUSHI;TOKUNAGA KATSUHISA;MORI MASAYOSHI;NAKANO TADASHI
分类号 C25F7/00;H01L23/50;(IPC1-7):C25F7/00 主分类号 C25F7/00
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