发明名称 |
SURFACE WAVE PLASMA ETCHING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a surface wave plasma etching apparatus. SOLUTION: An etching apparatus includes an upper region 100 for irradiating microwaves and a lower region for promoting etching. The upper region has a microwave restraining plate 116 interposed between upper and lower glass plates 110 and 114. As a result of the microwave restraining plate 116 interposed between the upper and lower glass plates 110 and 114, the problem of polluted particles generated from the microwave restraining plate 116 sputtered by the plasma can be prevented. |
申请公布号 |
JPH11340212(A) |
申请公布日期 |
1999.12.10 |
申请号 |
JP19990043721 |
申请日期 |
1999.02.22 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
LEE CHOL-KYU |
分类号 |
H01L21/302;C23F4/00;H01J37/32;H01L21/3065;H05H1/46 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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