COPPER FOIL FOR PRINTED CIRCUIT BOARD AND COPPER FOIL ATTACHED WITH RESIN

摘要

PROBLEM TO BE SOLVED: To provide a copper foil for a printed circuit board for forming a high density ultrafine wirings by enhancing a connecting strength with a base material. SOLUTION: This copper foil for a printed circuit board comprises an electrolytic copper foil 1 of a roughed surface 1a, having a surface roughness (Rz) of 2.0 to 4.0μm, a nickel layer 2 formed on the surface 1a of the foil and having a thickness of 0.01 to 0.05 mg/dm<2> , and a zinc layer 3 formed on the layer 2 having a thickness of 0.15 to 0.5 mg/dm<2> .