| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a plastic package can be manufactured with high workability and inexpensively. SOLUTION: A lead frame 2 is used at the time of performing such an insert molding that the molded surface in a parts housing space formed of a molding resin 5 and the external surface of an inner lead section 3 are flush with each other. At a prescribed position in the inner lead section 3, a ruggedness structure 11 is formed for preventing the formation of molding burrs. After the insert molding is performed with the use of the lead frame 2, a conductor 9 is bonded to a region where the recessing and projecting structure 11 is formed by using the region as a conductor bonding area B1. |
