| 摘要 |
PROBLEM TO BE SOLVED: To prevent a sink from being generated to obtain an excellent surface smoothness and productivity by burying a loop coil for antenna and an IC chip in a polymer which has a softening point lower than that of a plastic sheet. SOLUTION: A plastic film 5 where IC chips 3 and loop coils 4 for antenna are arranged is interposed between plastic sheets 2 provided with polymer layers 1, and they are stuck to each other by thermal welding. The polymer, where the IC chip 3, the loop coil 4 for antenna, etc., are buried, is not especially limited if it has a softening point lower than that of the plastic sheets 2 and is superior in adhesion strength to an adhesion object due to thermal fusion. The polymer is interposed between two plastic sheets 2 and is heated from outside and then is fused and made fluid to bury the IC chip 3, etc., and therefore, it is necessary that the softening point of the polymer is lower than that of the plastic sheets 2. |
