INTEGRATED SEMICONDUCTOR CIRCUIT PACKAGE AND METHOD

摘要

An integrated circuit package features a hermetically sealed cap bonded to a substrate by a printed glass frame. Printed circuit metallization extends under the cap and frame from the central area of the substrate surface to the edge of the surface. Connecting lugs are bonded to this metallization at the extremities of the substrate surface. At the central area of the substrate surface, the means for connecting the inner portion of the metallization to the integrated circuit terminals traverses and insulated support member. The printed metallization paths can cross each other and are insulated by printed insulation at the crossing points.