| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate improved in bond strength between a dielectric layer and barrier ribs, suppressing break of the barrier ribs wen gas is sealed, and having a high yield by burying part of the barrier ribs a specific quantity into the dielectric layer. SOLUTION: Electrodes 2, a dielectric layer 3 and barrier ribs 4 are formed on a glass substrate 1, and part of the barrier ribs 4 are buried in the dielectric layer 3, and buried quantity A is set to 1-10 μm. The dielectric layer 3 and the barrier ribs 4 are formed on the glass substrate 1 with a dielectric paste mainly made of glass powder and na organic binder and a barrier rib paste mainly made of glass powder and an organic binder in this manufacturing method for the substrate 1, and the relation 5<=Tr-Td<=50 is preferably satisfied, where Tr( deg.C) is the thermosoftening temperature of the glass powder in the barrier rib paste, and Td( deg.C) is the thermosoftening temperature of the glass powder in the dielectric paste. The baking temperature when the dielectric layer 3 is formed is preferably set lower by 5-40 deg.C than the baking temperature when the barrier ribs 4 are formed. |
