| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform highly reliable electric connection by a conductive adhesive material and to improve productivity, in the mounting method of a semiconductor, IC for connecting the bump of a semiconductor IC chip and the electrode terminal of a wiring board by the conductive adhesive material, filling sealing resin in the clearance part of the semiconductor IC chip and the wiring board, and fixing both. SOLUTION: As the conductive adhesive material 13, the adhesive material of small compatibility to the sealing resin 15 is used. The bump 2 of the semiconductor IC chip 1 supplied with the conductive adhesive material 13 is positioned and brought into contact with the electrode terminal 6 of the wiring board 4, then the sealing resin 15 is filled in the clearance part of the semiconductor IC chip 1 and the wiring board 4 and then, the conductive adhesive material 13 and the sealing resin 15 are simultaneously hardened. Since the conductive adhesive material 13 of the small compatibility is used, it is hardly mixed with the sealing resin 15.</p> |
