发明名称 FLIP-CHIP OPTICAL SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To emit light at a high luminance with few short-circuits by providing a protective film covering the surface of nitride semiconductor layers with a laminate, comprising a first layer made of an insulating film, a metal layer formed on the first layer, and a second layer made of an insulating film and formed on the metal layer. SOLUTION: After forming an n-type nitride semiconductor film and a film of a p-type nitride semiconductor on a sapphire substrate 104, the p-type nitride semiconductor is etched in part to thereby expose the surface of the n-type nitride semiconductor layer. After forming electrodes 110, 111 and 112 on the p and n-type nitride semiconductors, a silicon oxide film is formed over the whole surface. Etching is effected, using the silicon oxide film as a mask to thereby expose part of the electrode surfaces, and an insulating film which is a first layer 101 is formed. Then, a platinum film is formed to thereby form a metal layer 102 on the layer 101. Furthermore, a second layer 103 of an insulating layer is formed on the layer 102 by processing the silicon oxide film by a plasma CVD method. As a result, a three-layered protective film is formed.
申请公布号 JPH11340514(A) 申请公布日期 1999.12.10
申请号 JP19980141873 申请日期 1998.05.22
申请人 NICHIA CHEM IND LTD 发明人 TAKAOKA YOSHIKAZU
分类号 H01L33/32;H01L33/36;H01L33/44;H01L33/62 主分类号 H01L33/32
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