| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device of high performance. SOLUTION: As pads for wire bonding on a first semiconductor integrated circuit 1, other than a first pad 2 connected to a circuit on the semiconductor integrated circuit 1, the two kinds of plural second pads 3 mutually connected without being connected to the circuit on the semiconductor integrated circuit 1, and a third pad 4 independently present without being connected to the circuit on the semiconductor integrated circuit 1 or the other pads, are provided. On the same comb 6, a second semiconductor integrated circuit 7 is arranged in the state of being brought closer to the first semiconductor integrated circuit 1. Wire bonding is performed from an optional lead 18 to one of the second pads 3 on the first semiconductor integrated circuit 1, and wire bonding is performed from the other second pad 3 to the pad of the second semiconductor integrated circuit 7 further without passing through the lead. To the semiconductor integrated circuit 1, wire bonding is performed from the optional lead 19 to the third pad 4 on the first semiconductor integrated circuit 1. |
