COPPER FOIL FOR PRINTED CIRCUIT BOARD AND COPPER FOIL ATTACHED WITH RESIN

摘要

PROBLEM TO BE SOLVED: To provide a copper foil for a printed circuit board for forming a high density ultrafine wirings by enhancing a connecting strength with a base material. SOLUTION: An electric copper foil 1 for a printed circuit board comprises a roughed surface having a surface roughness (Rz) of 2.0 to 4.0μm. The foil has a primary protrusion layer 2 formed on a smooth surface 1A of the electrolytic copper foil 1 including a surface roughness (Rz) of 0.2μm or less and occupying 80% or more of particles 2a which have a particle size of 0.5 to 2.0μm. A secondary protrusion layer 3 is formed on the layer 2 with particles 3a occupying 80% or more and having a particle size of 0.01 to 0.5μm in such a manner that the layer 3 is covered with a zinc layer 4 with a thickness of 0.15 to 0.5 mg/dm<2> .