| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity, to reduce the cost and to attain an excellent contact due to the homogeneity and stability of plated film quality and the prevention of light leakage by forming the electrodes of a substrate by electrolytic plating, or electroless plating, or electroless plating and electrolytic plating with no etching. SOLUTION: An ITO film 21 formed on the surface of a transparent glass substrate 20 by spattering is patterned into stripes by photolithography and etching to form many transparent electrodes 22. A resist pattern 24 having opening patterns 23 and covering the transparent electrodes 22 is formed. Electrolytic plating is applied to form bus electrodes 28 having a three-layer structure of a Ni layer 25, a Cu layer 26 and a Ni layer 27 on the transparent electrodes 22 arranged in the opening pattern 23. The bus electrodes 28 and the transparent electrodes 22 are covered with a screen to form a dielectric layer 29, and a protective film 30 made of MgO is formed on the dielectric layer 29 by deposition or spattering to obtain a front substrate 31. |
