| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of residual stress in a joining agent and to improve connection reliability between electrode terminals in a mounting structure body for loading a semiconductor chip to a substrate by using the joining agent such as ACF or the like. SOLUTION: This mounting structure body of the semiconductor chip is provided with a semiconductor chip 6 provided with plural bumps 16 and a circuit board 3 provided with plural output wirings 11 and input terminals 12. The ACF 4 connects the semiconductor chip 6 and the circuit board 3 so as to mutually conduct the bumps 16 and the land part of the output wirings 11 or the like by receiving a press fitting processing. By dispersing and disposing plural through-holes 10 inside an area surrounded by the land part of the wirings 11 and the terminals 12 on the circuit board 3 and allowing the ACF 4 to be excessive at the time of the press fitting processing to escape through the through-holes 10, the generation of large internal stress in the ACF 4 is prevented. Thus, the connection reliability relating to an IC 6 is improved. |
