| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a resin card of high quality without breaking an IC chip or the like to be incorporated. SOLUTION: This manufacturing equipment is provided with a carrying device part 12 for carrying a pair of clamping plates 21 having infrared transmissivity clamping a work W wherein an inlet sheet where an IC chip is mounted to a coil antenna is arranged between card base materials. A heating device part 13 for heating the work W carried by the carrying device part 12 is provided, and a pressurizing device part 14 for pressurizing the work W heated by the heating device part 13 from the front and the back and integrating it is provided. The heating device part 13 is constituted of a pair of heating panels 25 for radiating infrared rays from the upper and lower parts of the carrying path of the work W and transmitting them through the clamping plates 21. The infrared rays from the heating panels 25 of the heating device 13 are transmitted through the clamping plates 21, the work W is heated, the heated work W is pressurized and also cooled in the pressurizing device part 14 and the resin card of an IC chip-incorporated type is manufactured. |
