| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and method for chucking which can speedily release a chucking means from a chucking state wherein the chucking means chucks an object and also provide a semiconductor manufacturing equipment using the chucking means and method. SOLUTION: While a chucking means (pick-up collet) 3 chucks an object 5, a storing means 15 is preliminarily filled with air for releasing the means 3 from the chucking state by means of an air controller 11. Then, when the chucking means 3 is released from the chucking state, a controller 13 controls the storing means 15 to supply air to the means 3 to release it from the chucking state.</p> |
