| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating plate for an integrated circuit module which is precisely in surface-contact with a heat generating element different in height from a subboard, and restrains temperature rise of an electronic apparatus. SOLUTION: In this heat dissipating plate 20, one or a plurality of upheaval parts 25, 26 are protruded from a main surface part 28 having a thickness where blanks are thinned by forging and molding, and a plurality of radiation fins 20a which are simultaneously molded at the time of forging and molding are arranged. A pawl part 23 and a guide trench 24 are formed on a part which is extended to a side direction by forging and molding. When a module is assembled by clamping a subboard between a lid member and the heat dissipating plate 20, an electronic apparatus turning to a heat generating source is in surface-contact with the main surface part 28 and the upheaval parts 25, 26. Since the main surface part 28, the upheaval parts 25, 26 and the heat radiation fins 20a are simultaneously molded by forging, a main surface 27 where strain is little and flatness is high is arranged, heat transfer from the heat generating source to the heat radiation fins 20a is accelerated, and high cooling capacity is exhibited. |
