| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of such nonconformity that the trimming of a resistor becomes impossible due to the imperfect contact of a probe pin when the resistance of the resistor is measured during the manufacturing process of a chip type resistor. SOLUTION: The upper surface of an insulating substrate A is divided into many grid pattern areas by forming primary break grooves 11 and secondary break grooves 12 on the surface and the assembled grid pattern area rows divided in bar-like states along the primary break grooves 11 are used as unit area assembled columns 2a and dummy area assembled columns 3a at every other column. In addition, a resistor 6 and an electrode 4 are formed in each unit area 2 of the unit area assembled column 2a and, at the same time, an electrode 5 exclusively used for measuring resistance which is removed after division is formed in each dummy area 3 of the dummy area assembled columns 3a by extending the electrode 4 from the adjacent unit area 2.</p> |
