| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for vacuum lamination of an adhesive sheet for making a build-up type multilayer printed wiring board, on which conductive circuit layers and insulating layers are laminated alternately to each other, by not having film-like adhesives seep out to internal layer circuit patterns. SOLUTION: Vacuum lamination of a holding film and a resin component material layer stacked thereon takes place at a high-temperature high-pressure condition on a patterned circuit substrate, wherein the resin component material layer is made of a resin component material of thermoplastic type and is solid at a room temperature. A method for vacuum lamination and equipment thereof are presented, wherein vacuum lamination using an adhesive film reduces seeping out of the resin component material by laminating with a seep-preventing sheet having small size of 1-8 mm from the edge of the resin component material and a height of more than that of the resin component material layer, and thus a method for vacuum lamination and an apparatus arise using an adhesive film which reduces seep out of the resin component material from the edge.</p> |
