发明名称 METHOD AND APPARATUS FOR CLAMPING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for clamping a substrate which is capable of accurately clamp a substrate and avoiding friction of guide grooves and breaks of the substrate. SOLUTION: A vertical clamping step of lifting a backup member 73 to stepwise push a substrate S up, until the substrate S introduced to specified position with its both side edges guided by U-shaped guide grooves 44 abuts the top faces of the guide grooves 44, substrate moving step of repeatedly moving a clamp member 46a reciprocally in the widthwise direction of the substrate S each time of the stepwise pushing operation, and lateral clamping step of moving the clamp member 46a fore in the widthwise direction of the substrate S to finally push the substrate S to the side face of one guide groove 44, are comprised.
申请公布号 JPH11340696(A) 申请公布日期 1999.12.10
申请号 JP19980156807 申请日期 1998.05.21
申请人 SANYO ELECTRIC CO LTD 发明人 KURIHARA SHIGERU;OYAMA KAZUYOSHI;HIRANO KATSUMI
分类号 H05K13/04 主分类号 H05K13/04
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