| 摘要 |
<p>A device for uniformly applying paste, which applies a noble metal paste on the inner surfaces of parts such as electronic parts in a desired configuration. The device is constituted of a mount (10) for mounting thereto parts (2, 8) to be coated with a paste, a nozzle (16) for supplying the paste, a delivery member (21) which covers the tip end of the nozzle (16), delivery ports (22) extending through the nozzle (16) and the delivery member (21), means for adjusting a spacing (h) between the surface of the delivery member and the surface of each part to be coated with the paste to 10 to 100 νm, means for delivering the paste with such spacing kept, and means for moving the parts and the nozzle relative to each other with the spacing maintained while the paste is delivered. Since a predetermined amount of paste is delivered to the parts with the spacing maintained, a paste film having an exceedingly uniform thickness can be formed on the surfaces of the parts. Accordingly, it is possible to form an electrode film of good quality which is uniform in terms of resistance performance and electric conductive performance and is provided with a metallic film of an exceedingly uniform thickness formed after drying and baking. As noble metals such as platinum are extremely expensive, limiting the electrode thickness can minimize the amount of a noble metal used and thus contribute to reduction in electronic part unit price.</p> |
