According to the invention, the conductor pattern is configured such that the connection pads (P1) are respectively connected via a conductor region with a reduced width (LB1) to the conductor tabs (LZ) which extend the conductor. A solder layer deposited on the conductor pattern is preferably remelted by a laser beam, whereby the solder flows up to the connection pads (P1) and forms solder bumps there.
申请公布号
WO9963795(A1)
申请公布日期
1999.12.09
申请号
WO1999EP03802
申请日期
1999.06.01
申请人
SIEMENS S. A.;ASCHENBRENNER, ROLF;KLOESER, JOACHIM;JUNG, ERIK;BOONE, LUC;DE STEUR, HUBERT;HEERMAN, MARCEL;VAN PUYMBROECK, JOZEF
发明人
ASCHENBRENNER, ROLF;KLOESER, JOACHIM;JUNG, ERIK;BOONE, LUC;DE STEUR, HUBERT;HEERMAN, MARCEL;VAN PUYMBROECK, JOZEF