| 摘要 |
PROBLEM TO BE SOLVED: To reduce influence upon electromagnetic coupling property which is to be caused by a wiring layer formed on an external circuit board, in a mounting structure of a package having an electromagnetic coupling part to the external circuit board. SOLUTION: In a package 1 for high frequency, a first signal transmission line 7 whose one end is connected with a high frequency element 5 is formed on the surface of a dielectric substrate 2, a second signal transmission line 8 is formed on the bottom surface of the dielectric substrate 2, a first ground layer 6 is formed in the dielectric substrate 2, and the other end of the first signal transmission line 7 and one end of the second signal transmission line 8 are faced each other by interposing a slot hole 9 formed on the ground layer 6 and electromagnetically coupled. In a structure mounting the package 1 for high frequency on the surface of an external circuit board 10 where a third signal transmission line 12 is formed at least on the surface, and a second ground layer 13 is formed inside, a region 15 where a ground layer is not formed is formed at least in a part positioned just under at least a slot hole 9 forming part of the second ground layer 13 in the external circuit board 10. It is preferable that a plurality of through hole conductors are formed in the second ground layer 13 around the region 15. |
