SEMICONDUCTOR DEVICE

摘要

A semiconductor device (A) comprises a semiconductor chip (1), a first lead (4) bonded to the semiconductor chip (l), a second lead (5) connected with the semiconductor chip (1) through wire (W), and a resin package (2) in which the wire (W) is molded. The first lead (4) and the second lead (5) include inner terminals (4a, 5b) buried in the resin package (2), any of which is bent toward the resin thickness.