发明名称 ENHANCED MOUNTING PADS FOR PRINTED CIRCUIT BOARDS
摘要 There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.
申请公布号 CA2273754(A1) 申请公布日期 1999.12.08
申请号 CA19992273754 申请日期 1999.06.07
申请人 FORD MOTOR COMPANY OF CANADA LIMITED 发明人 JAIRAZBHOY, VIVEK;MCMILLAN, RICHARD;BRUNNER, BJOERN
分类号 H05K1/11;H05K3/34;(IPC1-7):H05K1/02;H05K1/18;H05K3/00 主分类号 H05K1/11
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