发明名称 |
ENHANCED MOUNTING PADS FOR PRINTED CIRCUIT BOARDS |
摘要 |
There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.
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申请公布号 |
CA2273754(A1) |
申请公布日期 |
1999.12.08 |
申请号 |
CA19992273754 |
申请日期 |
1999.06.07 |
申请人 |
FORD MOTOR COMPANY OF CANADA LIMITED |
发明人 |
JAIRAZBHOY, VIVEK;MCMILLAN, RICHARD;BRUNNER, BJOERN |
分类号 |
H05K1/11;H05K3/34;(IPC1-7):H05K1/02;H05K1/18;H05K3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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