发明名称 Lead-out terminals for semiconductor packages
摘要 The lead-out terminal 36, formed by punching a metal plate and by bending the punched out metal plate, includes a flat plate section 365, an external terminal section 360, and connecting sections 361, 362, 363 and 364. The external terminal section 360 extends in parallel to the Y-axis when the flat plate section 365 is placed along the Z-X plane. The connecting sections 361, 362, 363 and 364 are much longer with respect to their thickness. The connecting sections 361, 362, 363 and 364 extend along the Z-axis from and in parallel to the flat plate section 365 and are bent downward at their middle portions. Cutouts 361a, 362a, 363a and 364a are disposed in the connecting sections 361, 362, 363 and 364, respectively, as stress relaxing means for relaxing stress along three orthogonal axes. The sections 361-364 are soldered to circuit patterns on substrates on which devices such as IGBT's are mounted within a casing. The flat plate section 365 is fixed to the casing and the external terminal section 360 is bent at notches 360a, 360b and fixed to the outside of the top surface of the casing.
申请公布号 GB2338108(A) 申请公布日期 1999.12.08
申请号 GB19990011965 申请日期 1999.05.21
申请人 * FUJI ELECTRIC COMPANY LIMITED 发明人 TAKATOSHI * KOBAYASHI;SOUICHI * OKITA;RIKIHIRO * MARUYAMA
分类号 H01L23/48;H01L23/495;H01L25/07 主分类号 H01L23/48
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