发明名称 Surface-mount coil
摘要 A surface-mount coil comprising a coil body including a core (5) with a wind frame portion (3) ofwhich winding is applied. The core (5) comprising the wind frame portion (3) and upper and lower flange portions (1, 2) formed to extend at opposite ends of the wind frame portion (3), and lead frames (10', 11') including external connection terminals (6, 7) to surfaces of which solderable layers (31) are bonded and core placing portions (8, 9) extending from the external connection terminals (6, 7) and having widths larger than widths of the external connection terminals (6, 7). The coil body being fixed by bonding to upper faces (8a, 9a) of the core placing portions (8, 9) of the lead frames (10', 11'), and end portions of the winding being conductively connected to the lead frames (10', 11'), The solder adhesion preventing layers (25) are formed at lower faces (8A, 9A) of the core placing portions (8, 9) of the lead frames (10', 11'), or at boundary portions (33) between the external connection terminals (6, 7) and the core placing portions (8, 9) at lower faces of the lead frames (10', 11'). <IMAGE>
申请公布号 EP0945880(A3) 申请公布日期 1999.12.08
申请号 EP19990106318 申请日期 1999.03.26
申请人 TAIYO YUDEN CO., LTD. 发明人 KUROIWA, KATSUTOSHI;TAJIMA, TAKASHI
分类号 H01F27/06;H01F17/04;H01F27/29;H05K3/34 主分类号 H01F27/06
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