| 摘要 |
A method and apparatus for machining an electrically conductive film at a low cost,suitable for multi-product small-amount production are provided to reduce variations in resulting dimensions, a partially remaining conductive film, damages to an insulating substrate, and so on after machining, while eliminating the need for a waste liquid treatment, which would be required when a lithographic method including etching processing is employed. The apparatus includes a YAG laser for emitting near infrared laser light (at wavelength lambda = 1064 nm), an optical system including a step index type optical fiber for guiding the laser light emitted from the laser to the vicinity of an electrically conductive film on an insulating transparent substrate, an X-Y stage having a carrier for carrying the transparent substrate thereon, and a controller for controlling and driving the X-Y stage to move the transparent substrate in a direction orthogonal to a direction in which the laser light is irradiated. Instead of the optical fiber, a kaleido scope may be used. <IMAGE> |
