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发明名称
METHOD AND DEVICE FOR GRINDING WAFER
摘要
申请公布号
JPH11333680(A)
申请公布日期
1999.12.07
申请号
JP19980142921
申请日期
1998.05.25
申请人
TOSHIBA CORP
发明人
NUNOTANI NOBUHITO
分类号
B24B9/00;H01L21/304;(IPC1-7):B24B9/00
主分类号
B24B9/00
代理机构
代理人
主权项
地址
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