| 发明名称 |
Fabrication process using a multi-layer antireflective layer |
| 摘要 |
A fabrication process includes a step of providing a substrate to be fabricated. A multi-layer antireflective layer is then formed on the substrate. A patterned resist having a thickness less than 850 nanometers is formed on the multi-layer antireflective layer and the substrate is fabricated using the patterned resist as a mask.
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| 申请公布号 |
US5998100(A) |
申请公布日期 |
1999.12.07 |
| 申请号 |
US19970924652 |
申请日期 |
1997.09.05 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
AZUMA, TSUKASA;OHIWA, TOKUHISA;MATSUDA, TETSUO;DOBUZINSKY, DAVID M.;OKUMURA, KATSUYA |
| 分类号 |
G03F7/11;G03F7/09;H01L21/027;(IPC1-7):G03F7/00 |
主分类号 |
G03F7/11 |
| 代理机构 |
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