发明名称 METHOD AND APPARATUS FOR STICKING FILM
摘要 PROBLEM TO BE SOLVED: To cover the inner surface of a minute recession part completely by a method in which films, after being stuck to a substrate, are heated in specified conditions, a photosensitive resin layer is swelled by heat and a laminating liquid, fluidized, and cooled to a specified temperature. SOLUTION: A laminating liquid 25 is adhered to both sides of a substrate 16, enters lots of minute recession parts formed on the sides, and adheres to close them. Next, films 22A, 22B are stuck by upper and lower side laminating rolls 18, 20. Next, when the substrate 16 passes through a heating zone 26, it is heated at 40-120 deg.C for 90-1 min. In this way, a photosensitive resin layer is swelled by the laminating liquid 25 in the recession parts, its fluidity is increased by heating, and the resin layer is packed in the recession parts. In addition, in this state, the substrate 16 passes through a cooling zone 28 in order to be cooled at 35 deg.C or below.
申请公布号 JPH11333930(A) 申请公布日期 1999.12.07
申请号 JP19980148955 申请日期 1998.05.29
申请人 SOMAR CORP 发明人 OGITANI OSAMU
分类号 B29C63/02;B29C65/00;B29L9/00;H05K3/06;(IPC1-7):B29C63/02 主分类号 B29C63/02
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