发明名称 Multilayer integrated assembly having specialized intermediary substrate
摘要 A multilayer integrated assembly for effecting fluid handling functions includes complementary microstructures formed by an etching or similar process in a planar foldable substrate. The complementary microstructures may be superimposed in a controlled manner by operation of micro-alignment means also formed in the foldable substrate by an etching or similar process. Microstructures are contemplated as including channels (that may be superimposed to form fluid conduits), apertures, conduit apertures, sample processing compartments, and the like. An intermediary substrate may optionally be incorporated in the integrated assembly so as to provide a material having a thickness or composition that may differ in a useful characteristic from the material used to provide the foldable substrate and accordingly expand the functionality of the integrated assembly. The intermediary substrate may offer a surface treatment, structure, or function that is difficult or impractical to provide in the foldable substrate but which can be effectively provided in the material used to fabricated the intermediary substrate. The resulting integrated assembly may be bonded and subsequently operated to implement one or more fluid-handling functions.
申请公布号 US5997708(A) 申请公布日期 1999.12.07
申请号 US19970846607 申请日期 1997.04.30
申请人 HEWLETT-PACKARD COMPANY 发明人 CRAIG, STEPHEN R.
分类号 B01D15/08;G01N30/04;(IPC1-7):B32B31/28 主分类号 B01D15/08
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