发明名称 EPOXY RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having improved mold releasability without using a spray type external releasing agent by adding a specific compound to a composition comprising an epoxy resin, a curing agent, a curing accelerator and a specific compound. SOLUTION: This composition comprises an epoxy resin, a curing agent, a curing accelerator and 0.05-5 wt.% of the ethoxylation product of a >=18C linear primary alcohol. Therein, one or more kinds of materials selected from an epoxy resin having unit structures of formula I [R1 -R4 are each H or a 1-12C hydrocarbon such as CH2 R' (R' is a hydrocarbon)] in the skeleton, a curing agent of formula II R5 -R7 are each (CH2 )n [(n) is 1-12]} and a curing agent of formula III [(n) is >=0]. The epoxy resin having the structural units of material I is preferably added in an amount of 0.05-50 wt.% based on the total amount of the epoxy resin. The curing agents of formula II or III is preferably added in an amount of 0.05-20 wt.% based on the total amount of the curing agent.
申请公布号 JPH11335445(A) 申请公布日期 1999.12.07
申请号 JP19980162927 申请日期 1998.05.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NAKASUJI IKUO;YAMANAKA HIROSHI
分类号 C08L63/00;C08G59/66;(IPC1-7):C08G59/66 主分类号 C08L63/00
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