发明名称 |
Photosensitive resin composition comprising fullerene |
摘要 |
Disclosed are a photosensitive resin composition containing a fullerene and a polymer compound bearing a functional group which can react with the fullerene under irradiation of visible light; method for forming negative-type picture elements comprising steps of: forming a layer composed of the above composition, irradiating the layer with visible light through a photo mask having a pattern transmitting the visible light as a part of the mask to cure portions of the layer irradiated by the visible light, and removing uncured portions of the layer to form a resist film having cured portions of the pattern: and a method for producing devices comprising steps of: forming a layer of the above composition on an image-forming layer provided on a substrate, irradiating the layer with visible light through a photo mask having a pattern transmitting the visible light as a part of the mask to cure portions of the layer irradiated by the visible light, removing uncured portions of the layer to form a resist film having cured portions of the pattern, etching exposed portions of the image-forming layer, and removing the resist film. The composition and methods of the present invention enable production of negative type picture elements and devices with light of visible range.
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申请公布号 |
US5998089(A) |
申请公布日期 |
1999.12.07 |
申请号 |
US19970928337 |
申请日期 |
1997.09.12 |
申请人 |
THE INSTITUTE OF PHYSICAL AND CHEMICAL RESEARCH |
发明人 |
TAJIMA, YUSUKE;ISHII, TADAHIRO;TAKEUCHI, KAZUO |
分类号 |
G03F7/004;C08L101/02;C09D5/00;C09D133/06;G03F7/038;H05K3/28;(IPC1-7):G03C1/492;C08J3/28 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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