Dielectric pastes and tapes, and metal substrates coated therewith

摘要

The present invention relates to dielectric materials which may be used in the manufacture of, e.g., low profile heaters. Such dielectric materials comprise at least about 50% of a glass composition having about 35-50% SiO2, about 30-40% of an alkaline earth metal oxide selected from the group consisting of CaO, MgO, and SrO, about 13-22% Al2O3, and about 0-10% B2O3, the percentages being weight percentages based on the weight of the total glass composition. Certain dielectric compositions of the disclosure have a linear thermal expansion coefficient in the range of about 6.0 to 9.0 ppm/ DEG C.